| 摘要 |
PURPOSE: A processing apparatus is provided to easily change a discharge location of a process gas without changing a location of a circular partition member or a processing gas discharge unit. CONSTITUTION: A process chamber(2) processes a wafer(W) by using a process gas. A mounting table(4) mounts the wafer while being installed in the process chamber. The mounting table is connected to a second high frequency power supply(9) by interposing a matching device(8). A processing gas discharge unit(5) is installed within the process chamber facing the mounting table. The processing gas discharge unit discharges the process gas to the process chamber. The processing gas discharge unit is connected to a first high frequency power(7) by interposing a matching device(6).
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