发明名称 SUSPENSION SUBSTRATE WITH CIRCUIT AND METHOD FOR MANUFACTURING THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide a suspension substrate with a circuit which can execute inspections of conduction of a conductor pattern and operation of a magnetic head with excellent reliability by improving adhesiveness between a metal plating layer and a support terminal, and to provide a method for manufacturing the same. <P>SOLUTION: A method for manufacturing a suspension substrate with a circuit includes: preparing a metal support substrate 2; forming a base insulating layer 3 on which a base opening 11 is formed; forming a conductor pattern 4 including a head-side terminal 6, an external-side terminal 7 to be filled in the base opening 11 of the base insulating layer 3, and a wire 8, on the base insulating layer 3; forming a support terminal 13 which is electrically insulated from the surrounding metal support substrate 2 and is electrically connected to the external-side terminal 7, on the metal support substrate 2; forming a conductive layer 14 having thickness of 10 nm or more and 200 nm or less below the support terminal 13; and forming a metal plating layer 15 below the conductive layer 14. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012104189(A) 申请公布日期 2012.05.31
申请号 JP20100251655 申请日期 2010.11.10
申请人 NITTO DENKO CORP 发明人 SUGIMOTO YU
分类号 G11B5/60 主分类号 G11B5/60
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