| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a microchip which can be molded under low-temperature mold conditions, exhibits a high mold-release property and high shape stability while ensuring its transferability, causes no defects of molding such as weld lines near a chamber or deformation of its transfer surface, exhibits high thermal responsiveness, and can be manufactured in short molding cycles and at a low cost, and to provide a method for manufacturing the same. <P>SOLUTION: In the microchip 2, several flow channels 20 which introduce a reagent inside or discharge it outside and the chamber 70 which communicates with the flow channels 20 and performs at least amplification of a specimen to be tested are formed by joining a resin substrate 3 and a film 4. The substrate 3 has a gate mark 80 made by mold filling which is formed at the gate of a mold for injection molding. The gate mark 80 made by mold filling is arranged right in front of the chamber 70 and upstream of the chamber 70 in the resin injection direction X. The chamber 70 lacks a part of the flow channels 20 on an extended line (center line Y) connecting the center of the gate mark 80 and the center of the chamber 70, when viewed from the direction of the thickness of the substrate 3. <P>COPYRIGHT: (C)2012,JPO&INPIT |
