发明名称 |
Methods for Wafer Bonding, and for Nucleating Bonding Nanophases |
摘要 |
Substrates may be bonded according to a method comprising contacting a first bonding surface of a first substrate with a second bonding surface of a second substrate to form an assembly; and compressing the assembly in the presence of an oxidizing atmosphere under suitable conditions to form a bonding layer between the first and second surfaces, wherein the first bonding surface comprises a polarized surface layer; the second bonding surface comprises a hydrophilic surface layer; the first and second bonding surfaces are different.
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申请公布号 |
US2012132263(A1) |
申请公布日期 |
2012.05.31 |
申请号 |
US201013259278 |
申请日期 |
2010.04.30 |
申请人 |
HERBOTS NICOLE;CULBERTSON ROBERT J.;BRADLEY JAMES;HART MURDOCK ALLEN;SELL DAVID ALEXANDER;WHALEY SHAWN DAVID;ARIZONA BOARD OF REGENTS, A BODY CORPORATE ACTINGFOR AND ON BEHALF OF ARIZONA STATE UNIVERSITY |
发明人 |
HERBOTS NICOLE;CULBERTSON ROBERT J.;BRADLEY JAMES;HART MURDOCK ALLEN;SELL DAVID ALEXANDER;WHALEY SHAWN DAVID |
分类号 |
H01L31/0312;B32B9/00;B32B15/00;B32B37/10;B32B37/26;B32B38/16;H01L21/18;H01L31/0264 |
主分类号 |
H01L31/0312 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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