发明名称 EPOXY RESIN AND RESIN COMPOSITION
摘要 <p>[Problem] To provide: an epoxy resin which exhibits low viscosity when used in a resin composition and which exhibits excellent heat resistance when used in a cured product; and a resin composition. [Solution] This resin composition comprises an epoxy resin (A) that has a total chlorine content of 0.01 to 1000ppm and a resin (B) that has a melting or softening point of 50°C or higher, the content of the epoxy resin (A) being 20 to 90% by mass relative to the total amount of all the resins.</p>
申请公布号 WO2012070387(A1) 申请公布日期 2012.05.31
申请号 WO2011JP75864 申请日期 2011.11.09
申请人 ASAHI KASEI E-MATERIALS CORPORATION;SHIMIZU, TAKEKI;SHIMODA, TERUYOSHI;TANIGUCHI, HIROKI;ARAI, TAKESHI;ONIZUKA, KENZOU 发明人 SHIMIZU, TAKEKI;SHIMODA, TERUYOSHI;TANIGUCHI, HIROKI;ARAI, TAKESHI;ONIZUKA, KENZOU
分类号 C08G59/20;C08G59/40;H01L21/52;H01L23/29;H01L23/31 主分类号 C08G59/20
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