| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a mount device capable of enhancing its utilization rate furthermore. <P>SOLUTION: A mount section for mounting an electronic component on a substrate comprises a mount head which conveys the electronic component while holding it, a tape delivery mechanism which sequentially feeds a carrier tape on which the electronic components are arranged and held in one row, and a buffer section where a required number of electronic components are stored during a time required for replacing the carrier tape. A control section designates the mount head to take out electronic components from a buffer section after all electronic components are taken out from the carrier tape until replacement of tape is completed, and to take out electronic components from the carrier tape during the other period of time. <P>COPYRIGHT: (C)2012,JPO&INPIT |
