| 摘要 |
<P>PROBLEM TO BE SOLVED: To drastically improve signal quality by performing impedance matching when fitting a semiconductor device to a socket. <P>SOLUTION: An external connection terminal 5a that is a signal pin of a semiconductor device 5 is connected to a socket pin 4b. A dielectric coating film 11b made of a dielectric substance is formed on an outer peripheral surface of a signal conducting cylinder 11a. When a lower contact pin 9 is in contact with a signal land 12 of a test wiring board 6, a ground conducting cylinder 11c comes into contact with ground pattern wiring 6a of the test wiring board 6. The socket pin 4b is inserted in and fixed to a through-hole 14 of a lower base 3, and the through-hole 14 is connected to ground wiring 13 formed on the lower base 3. The ground wiring 13 is formed, for example, into the shape of a ground plane and is connected to a socket pin 4a. <P>COPYRIGHT: (C)2012,JPO&INPIT |
