| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device mounted on a mounting substrate by using a solder bump, the semiconductor device which prevents generation of cracks in a neck part of the solder bump. <P>SOLUTION: The semiconductor device comprises a semiconductor substrate 2 in which a plurality of electrodes 4 are arranged on a surface 2a; an insulating layer 3 covering the surface 2a of the semiconductor substrate 2 and having a plurality of openings 3a exposing a plurality of electrodes 4 separately; a re-wiring layer 5 arranged on the insulating layer 3 and having one edge electrically connected to each of electrodes 4 via the opening 3a; a plurality of pads 6 electrically connected to every the re-wiring layer 5; and a plurality of solder bumps 7 formed on surfaces 6a of a plurality of pads 6 respectively. Surfaces 3b contacting with the pads 6 of the insulating layer 3 have individual inclinations so that the surfaces of the pads 6 face the central direction of the semiconductor substrate 2 respectively. <P>COPYRIGHT: (C)2012,JPO&INPIT |
