BUMP FOR SEMICONDUCTOR DEVICE PACKAGE AND METHOD FOR MANUFACTURING THE SAME

摘要

PURPOSE: A bump for a semiconductor device and a manufacturing method thereof are provided to prevent crack generation by coating a separate polymer film on the bump formed on a semiconductor chip into one body. CONSTITUTION: An opening part for exposing a metal pad(14) on a photo resist layer(22) is formed. A copper filler(32) of a predetermined height is formed on the exposed metal pad through a plating process. A conductive solder(34) is formed on the upper surface of the copper filler through the plating process. A reflow process with respect to the conductive solder is performed. The remaining photo resist layer which excludes a part of the photo resist layer which is performed as a polymer film(20) is removed.