A METHOD AND AN APPARATUS FOR FORMING ELECTRICALLY CONDUCTIVE VIAS IN A SUBSTRATE, AN AUTOMATED ROBOT-BASED MANUFACTURING SYSTEM, A COMPONENT COMPRISING A SUBSTRATE WITH VIA HOLES, AND AN INTERPOSER DEVICE

摘要

A method for forming conductive vias in a substrate (302) by filling preformed via holes (303-305), preferably through via holes, with conductive material, comprises providing a plurality of preformed objects at least partly comprising ferromagnetic material (301) on a surface of the substrate;providing a magnetic source (307) on an opposite side of the substrate with respect to the plurality of preformed objects, thereby at least partly aligning at least a portion of the preformed objects with a magnetic field associated with the magnetic source; and moving the magnetic source relative the substrate, or vice versa, thereby moving the at least portion of the preformed objects into at least a portion of the via holes.