METHOD OF MANUFACTURING FINE CUPPER POWDERS FOR ELECTRONIC MATERIALS USING SLURRY AND WET CHEMICAL REDUCTION

摘要

PURPOSE: A method for producing fine copper powder for an electronic material using a slurry-liquid reduction method is provided to obtain stabilized high-purity fine copper powder easy to control shape and grain size. CONSTITUTION: A method for producing fine copper powder for an electronic material comprises the steps of: preparing palladium suspension including palladium particles as copper powder forming seed(S110), adding Cu2O(Copper Oxide) to the palladium suspension to obtain Cu2O slurry(S120), and reducing Cu2O of the Cu2O slurry to form copper powder on the palladium particles(S130).