发明名称 HOUSING STRUCTURE OF POWER STORAGE DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To ensure good heat dissipation of the housing structure for a power storage device (10) by a half-cut case (1) in which dimensional variation in the case (1) or the power storage device (10) causes no trouble in the sealing of the mating surface of the case. <P>SOLUTION: The half-cut case (1) is configured by fitting a pair of resin case members (2) having thermal conductivity and electric insulation. An elastic sheet (11) having thermal conductivity and electric insulation is interposed between a power storage device (10) and the inner wall surface of each case member (2). A plurality of protrusions (12) which bite into the elastic sheet (11) and press the elastic sheet (11) against the power storage device (10) are provided on the inner wall surface of each case member (2). <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012104284(A) 申请公布日期 2012.05.31
申请号 JP20100250140 申请日期 2010.11.08
申请人 DAIKYONISHIKAWA CORP 发明人 ISOBE YOSHIAKI;HIRAKI KAZUYOSHI;UEMOTO SHINTARO;KAGEYAMA TAKUYA
分类号 H01M2/10;H01G2/08;H01G2/10;H01M10/60;H01M10/613;H01M10/625;H01M10/653;H01M10/6551 主分类号 H01M2/10
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