| 摘要 |
<P>PROBLEM TO BE SOLVED: To avoid peeling failure in an initial stage of adhesive sheet peeling. <P>SOLUTION: A sheet peeling device 10 includes delivery means 12 delivering a peeling tape PT, application means 13 applying the peeling tape PT to an adhesive sheet S, moving means 15 moving a semiconductor wafer W relative to the peeling tape PT and peeling the adhesive sheet S from the semiconductor wafer W, and spare peeling means 16. The spare peeling means 16 is provided so as to form a spare peeling region S2 relative to the adhesive sheet S from an intersection position P of an outer edge S1 of the adhesive sheet S and side end edges PT2 of the peeling tape PT by twisting the peeling tape PT applied to the adhesive sheet S. <P>COPYRIGHT: (C)2012,JPO&INPIT |
