LIGHT EMITTING DIODE CHIP INCLUDING WAVELENTH-CONVERTING LAYER AND METHOD FOR FABRICATING THE SAME

摘要

PURPOSE: A light emitting diode chip which includes a wavelength conversion layer and a manufacturing method thereof are provided to include an open region for exposing an electrode pad of a light emitting diode chip on the wavelength conversion layer beforehand, thereby easily forming a bump. CONSTITUTION: A light emitting diode chip comprises a substrate, a semiconductor structure(120), and an electrode pad(130). The semiconductor structure is arranged on the substrate. The electrode pad is electrically connected to the semiconductor structure. A wavelength conversion layer(140) comprises an upper conversion layer and a lower conversion layer covering a side surface of the light emitting diode chip. An open region is arranged for opening the electrode pad.