| 摘要 |
Systems and methods for cutting materials are disclosed herein In some embodiments, methods of at least partially severing a capillary vessel can include: focusing a laser on a predetermined point on the capillary vessel, said capillary vessel containing a biological sample; and cutting the capillary vessel using a laser at the predetermined point. In some embodiments, the methods further can include capturing an image of the capillary vessel and analyzing the image to determine the predetermined point. In some embodiments, a beam of the laser can be moved using one or more galvanometric mirrors. In some embodiments, the methods further can include cutting a plurality of capillary vessels using the laser. In some embodiments, the methods can include utilizing a plurality of lasers, and/or further can include rotating the capillary vessel while the laser can be cutting the capillary vessel. In some embodiments, cutting the capillary vessel can include cutting only a portion of the capillary vessel. |
