发明名称 Packaged device adapter assembly
摘要 An adapter apparatus is provided for receiving a packaged device having a plurality of contact elements disposed on a surface thereof. The adapter apparatus includes a perimeter wall member having a length along an adapter axis between a first end of the wall member and a second end of the wall member. A conductive element layer including arranged contact elements is positioned at the first end of the perimeter wall member orthogonal to the adapter axis. The perimeter wall member and the conductive element layer define a socket cavity to receive the packaged device with the contact elements thereof adjacent the arranged conductive elements of the conductive element layer. A cover member is positioned at the second end of the perimeter wall member to close the socket cavity. The cover member is movable to allow the packaged device to be removed from the socket cavity. The adapter apparatus may include a floating member moveable in the socket cavity and an actuator element operable to provide a force on the floating member such that a corresponding force is distributed to the packaged device when received in the socket cavity to provide effective electrical coupling between the contact elements of the packaged device and the arranged conductive elements of the conductive element layer, e.g., a conductive elastomer layer. Further, the perimeter wall member may include an inner surface facing towards the adapter axis and an outer surface facing in an opposing direction. The outer surface of the perimeter wall member may include an adhesive retaining surface adjacent the first end thereof, e.g., channels adjacent the first end, for use in receiving an adhesive to mount the assembly to a target board. Yet further, the adapter apparatus may include an alignment structure positioned in the socket cavity adjacent the conductive element layer and adjacent the surface of the packaged device on which the contact elements are disposed to align the contact elements of the packaged device with contact pads on a target board when the adapter apparatus is mounted relative thereto.
申请公布号 US6533589(B1) 申请公布日期 2003.03.18
申请号 US19990418388 申请日期 1999.10.14
申请人 IRONWOOD ELECTRONICS, INC. 发明人 PALANIAPPA ILAVARASAN;FEDDE MICKIEL
分类号 H01L23/32;(IPC1-7):H01R9/01 主分类号 H01L23/32
代理机构 代理人
主权项
地址