<p>There is provided a processing apparatus including a processing gas discharge unit 5 provided within a processing chamber 2 so as to face a mounting table 4 and configured to discharge a processing gas into the processing chamber 2; a first space 15a corresponding to a central portion in a surface of a processing target object; a second space 15i corresponding to an edge portion in the surface of the processing target object; at least one third space 15b to 15h formed between the first space 15a and the second space 15i; and a processing gas distribution unit 12 including processing gas distribution pipes 18a to 18i and valves 19a to 19h. The spaces 15a to 15i are provided within the processing gas discharge unit 5 and partitioned by partition walls 14. At the spaces 15a to 15i, there are formed discharge holes 16 for discharging the processing gas. The processing gas distribution pipes 18a to 18i communicate with the spaces, and the valves 19a to 19h are opened or closed to allow adjacent processing gas distribution pipes 18a to 18i to communicate with each other or be isolated from each other.</p>
