WAFER LEVEL PAKAGE OF MEMS SENSER AND METHOD FOR MANUFACTURING THE SAME

摘要

PURPOSE: A wafer level package of a MEMS sensor and a manufacturing method thereof are provided to improve electrical contact reliability of the internal side and external side of the MEMS sensor by forming a top cooperation electrode within top glass. CONSTITUTION: A top cooperation electrode and a bottom cooperation electrode are respectively formed on the upper side of bottom glass and top glass(210). Via hole is formed within the top glass. A MEMS(Micro-electro-mechanical system) structure(230) is formed on the upper side of the bottom glass. An outer frame(235) is formed on the edge of the upper side of the bottom glass. The top glass is bonded to the upper side of the outer frame. A contact pad is formed on the upper side of the MEMS structure. The via hole exposes the contact pad formed on the upper side of the MEMS structure.