| 摘要 |
Provided are an evaporation apparatus and a thin film forming method using the same. The evaporation apparatus and the thin film forming method are used to form a uniform thin film, even for a large substrate, and can be easily employed without changing equipment even if a substrate size is changed. The evaporation apparatus includes a first evaporation source, a second evaporation source separated from the first evaporation source, and a compensation member disposed between a target object and the first and second evaporation sources. The compensation member performs a linear movement simultaneously with the first and second evaporation sources. The compensation member includes a first compensation plate disposed in a position corresponding to the first evaporation source, and a second compensation plate disposed in a position corresponding to the second evaporation source. |
