发明名称 Heating apparatus, heating method, and computer readable storage medium
摘要 A disclosed heating apparatus for heating a substrate on which a film is coated includes a process chamber having a gas supply opening for supplying a first gas to the process chamber and a gas evacuation opening for evacuating the first gas from the process chamber; a heating plate that is arranged in the process chamber and includes a heating element for heating the substrate; plural protrusions arranged on the heating plate so as to support the substrate; plural suction holes formed in the heating plate so as to attract by suction the substrate toward the heating plate; and a gas inlet adapted to supply a second gas to a gap between the heating plate and the substrate supported by the plural protrusions.
申请公布号 US8186077(B2) 申请公布日期 2012.05.29
申请号 US201113153660 申请日期 2011.06.06
申请人 KAWAJI TATSUYA;SAKAI YUICHI;KANEDA MASATOSHI;TOKYO ELECTRON LIMITED 发明人 KAWAJI TATSUYA;SAKAI YUICHI;KANEDA MASATOSHI
分类号 F26B0011/000005 主分类号 F26B0011/000005
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