发明名称 |
Method for manufacturing substrate by imprinting |
摘要 |
While releasing property between a resin layer and an imprinting mold is given by using a metal thin film layer, a method for manufacturing a substrate advantageous for forming a conductive layer by plating and a substrate manufactured by the method are provided. According to one aspect of the present invention, a method for manufacturing a substrate by imprinting, the method comprising: laminating a metal thin film layer on top of a resin layer; pressurizing the resin layer and the metal thin film layer by an imprinting mold which comprises a side having a pattern in correspondence with a wiring pattern; curing a resin which forms the resin layer; and removing the imprinting mold from the resin layer and the metal thin film layer, may be presented.
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申请公布号 |
US8187518(B2) |
申请公布日期 |
2012.05.29 |
申请号 |
US20070713608 |
申请日期 |
2007.03.05 |
申请人 |
LEE CHOON-KEUN;HONG MYEONG-HO;HAN SEUNG-HEON;RA SENUG-HYUN;SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
LEE CHOON-KEUN;HONG MYEONG-HO;HAN SEUNG-HEON;RA SENUG-HYUN |
分类号 |
B29C43/00;B29C59/00;B32B37/00 |
主分类号 |
B29C43/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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