| 摘要 |
A full angle LED (light-emitting diode) illumination device comprises at least three copper base plates, a plurality of LED chips, and a flexible circuit layer. Each copper base plate is electroplated with a layer of silver thereon and the copper base plates are arranged in a crisscross pattern to form the backbone of a three-dimensional globe. Each LED chip is provided on the external surface of the three-dimensional globe at a site where any two copper base plates are crisscrossed. The flexible circuit layer is provided on the peripheries of the copper base plates and electrically connected with the LED chips for controlling the LED chips. Accordingly, it is able to provide full angle illumination range and to improve the thermal conductivity and heat dissipation capability in order to prolong effectively the lifetime of the LED chips in use. |
