发明名称 Method for manufacturing memory device
摘要 Objects are to solve inhibition of miniaturization of a memory element and complexity of a manufacturing process thereof, and to provide a nonvolatile memory device and a semiconductor device each having the memory device, in which data can be additionally written except at the time of manufacture and in which forgery or the like caused by rewriting of data can be prevented, and a memory device and a semiconductor device that are inexpensive and nonvolatile. The present invention provides a semiconductor device that includes a plurality of memory elements, in each of which a first conductive layer, a second conductive layer disposed beside the first conductive layer, and a mixed film that are disposed over the same insulating film. The mixed film contains an inorganic compound, an organic compound, and a halogen atom and is disposed between the first conductive layer and the second conductive layer.
申请公布号 US8187917(B2) 申请公布日期 2012.05.29
申请号 US201113008148 申请日期 2011.01.18
申请人 IKEDA HISAO;IBE TAKAHIRO;KOEZUKA JUNICHI;KATO KAORU;SEMICONDUCTOR ENERGY LABORATORY CO., LTD. 发明人 IKEDA HISAO;IBE TAKAHIRO;KOEZUKA JUNICHI;KATO KAORU
分类号 H01L29/08 主分类号 H01L29/08
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