| 摘要 |
PURPOSE: A light emitting device and a light emitting device package are provided to improve reliability of the emitting device by preventing a wire to be damaged during a process. CONSTITUTION: A first lead frame and a second lead frame are separately arranged on a same plane. An n-type semiconductor layer(130) is welded to the first lead frame. A p-type semiconductor layer(140) is welded to the second lead frame. An active layer(150) is arranged between the n-type semiconductor layer and the p-type semiconductor layer. A substrate is arranged in one side of the n-type semiconductor layer. Conductive paste is placed between the first lead frame and the -type semiconductor layer, and between the second lead frame and the p-type semiconductor layer. |
