发明名称 WOODY RESIN MOLDING
摘要 <P>PROBLEM TO BE SOLVED: To provide a woody resin molding having weatherability and heat resistance. <P>SOLUTION: The woody resin molding is provided with a covered layer consisting primarily of a polycarbonate resin including a structure unit derived from a dihydroxy compound having a portion represented by formula (1) in part of the structure on a surface of a base material comprising a woody resin composition including thermoplastic resin and wood power. (However, except the case in which the portion represented by formula (1) is part of -CH<SB POS="POST">2</SB>-O-H). <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012096395(A) 申请公布日期 2012.05.24
申请号 JP20100244341 申请日期 2010.10.29
申请人 MITSUBISHI CHEMICALS CORP 发明人 YOKOKI MASASHI;KITADE HIROSHI
分类号 B32B27/36;C08G64/00;C08L97/02;C08L101/00 主分类号 B32B27/36
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