发明名称 CHUCK DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To accurately support a silicon ingot, and to improve the polishing accuracy of the silicon ingot even if a non-polished part of the silicon ingot is shaped non-smoothly. <P>SOLUTION: A device includes a first bowl-shaped part 61 fixed to a motor shaft 52a of a workpiece support mechanism, rotated by the rotational drive of the motor shaft 52a, and making a part to be polished face a workpiece polishing mechanism; and a second bowl-shaped part 62 integrally rotatably disposed on the first bowl-shaped part 61 at the opposite side to the motor shaft 52a, and moving along a contour of an inclined shape of a first end WK1 while facing the first end WK1. Even if the first end WK1 has the inclined shape, the second bowl-shaped part 62 moves along the contour of the inclined shape, and stably holds the first end WK1 without displacement, thereby accurately supporting a prismatic silicon ingot WK and improving the polishing accuracy. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012096318(A) 申请公布日期 2012.05.24
申请号 JP20100246032 申请日期 2010.11.02
申请人 BBS KINMEI CO LTD 发明人 KAWAHARA RYUNOSUKE;MURAKAMI SHINICHI;ITO HIROYUKI
分类号 B24B41/06;B24B9/00 主分类号 B24B41/06
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