| 摘要 |
PURPOSE: An electro-plating apparatus is provided to improve plating performance by forming a plating layer on the upper surface of a wafer by spraying plating solution from the upper part of the wafer. CONSTITUTION: An electro-plating apparatus comprises a water tub(100), a wafer chuck(200), an electricity supply unit(300), a first protector(400), a second protector(500), and an anode(600). A plating solution feeding unit(110) is formed on the upper part of the water tub. The wafer chuck supports the wafer(900). The electricity supply unit is electrically connected to the wafer chuck and is extended from the lower part of the wafer chuck.
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