发明名称 FAST CURING WATERBORNE EPOXY COMPOSITION AND PROCESS FOR BUILDING FLOOR
摘要 PURPOSE: A quick-curable water-soluble epoxy composition is provided to be cured within two hours after spreading at room temperature, not to contain organic solvent, and to have short construction time. CONSTITUTION: A quick-curable water-soluble epoxy composition comprises water-soluble bisphenol A type epoxy epichlorohydrin, water-soluble polyamide, 3-glycidoxypropylmethyldiethoxysilane, and one or more additives selected from a frame retardant, a surfactant, a moisturizer, an antifoaming agent, graphite and water. A manufacturing method of the epoxy composition comprises: a step of putting the water-soluble bisphenol A type epoxy epichlorohydrin and water in order; a step of heating the materials; a step of putting the 3-glycidoxypropylmethyldiethoxysilane into the solution; a step of keeping the solution for one hour, and cooling temperature to room temperature; and a step of putting a frame retardant, a surfactant, a moisturizer, an antifoaming agent or graphite.
申请公布号 KR20120052690(A) 申请公布日期 2012.05.24
申请号 KR20100113964 申请日期 2010.11.16
申请人 IPOWER CO., LTD.;LEE, CHANG HUN 发明人 LEE, CHANG HUN
分类号 C08L63/00;C08G59/12;C08K5/5415;C08L77/00 主分类号 C08L63/00
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