| 摘要 |
<P>PROBLEM TO BE SOLVED: To suppress and prevent board deformation around an opening of a circuit board that can occur when an imaging element is mounted on the circuit board including the opening for imaging. <P>SOLUTION: In an area in which the opening for imaging and a housing recess are partially lined up in a direction perpendicular to the circuit board, when the length of the area along the inner edge of the opening for imaging is assumed to be L, each Ln (n=1 to 9) satisfies 0<Ln≤4t (t is the board thickness in an imaging element mounting area of the circuit board). <P>COPYRIGHT: (C)2012,JPO&INPIT |
