PLASTIC PACKAGES FOR MICROWAVE FREQUENCY APPLICATIONS

摘要

A plastic package for microwave applications up to 14 Ghz is disclosed. The plastic package includes a plastic platform (65), a lead frame embedded on the surface of the platform (65) and, in one embodiment, a plastic cap (75) mounted on the platform (65) so as to seal the chip (70) within the package. The lead frame includes a baseplate (71) for mounting at least one semiconductor chip (70), at least one ground lead attached to the baseplate (71) and extending outwardly therefrom, and at least one signal lead for conducting signals to or from such semiconductor chip (70). The signal lead and at least one ground lead are configured as a microwave transmission line such as microwave coplanar strips, or microwave coplanar waveguide for transmitting microwave frequency signals. The package offers a low inductance ground path, good thermal characteristics, and low parasitic inductance and capacitance. It can be applied for high speed and high frequency applications.