COPPER FOIL FOR PRINTED WIRING BOARD

摘要

Provided is a copper foil for a printed wiring board, the copper foil being suitable for achieving finer pitch, favorable in terms of manufacturing cost, and excellent both in etching ability and adhesion to an insulating substrate. The copper foil for a printed wiring board comprises a copper foil base material and a covering layer for covering at least a portion of a surface of the copper foil base material, wherein the covering layer is formed by an nickel-vanadium alloy layer containing nickel and vanadium, and a chromium layer, laminated in this order from the surface of the copper foil base material; the chromium layer contains chromium in an amount of 15-210 µg/dm2; the nickel-vanadium alloy layer contains nickel and vanadium in a combined covering amount of 20-600 µg/dm2; and the nickel-vanadium alloy layer contains vanadium in an amount of 3-70 wt%.