| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a mount substrate with a new structure which facilitates checking of the soldering state of the mount substrate and reduces false recognition of the checking. <P>SOLUTION: While multiple through holes 28 are penetratingly provided on a printed substrate 12, terminal parts 18 of multiple electronic components 14 disposed on one surface 20 of the printed substrate 12 are inserted in the respective through holes 18 and protruded from the other surface 22 of the printed substrate 12 to be soldered. Further, discrimination displays 36, which discriminate the through holes 28 for each electronic component 14, are provided on the other surface 22 of the printed substrate 12. <P>COPYRIGHT: (C)2012,JPO&INPIT |
