发明名称 Heat-Radiating Substrate and Method Of Manufacturing The Same
摘要 Disclosed herein are a heat-radiating substrate and a method of manufacturing the same. The heat-radiating substrate includes: a base substrate with a heat sink, having a groove; an insulating layer formed on the base substrate by performing anodization thereon; and a circuit layer formed on the insulating layer, whereby the heat-radiating substrate with the heat-sink, made of metal material, is manufactured, thereby making it possible to protect devices weak against heat and thus solve the problem in view of reduced life span and degraded reliability.
申请公布号 US2012127666(A1) 申请公布日期 2012.05.24
申请号 US201113007545 申请日期 2011.01.14
申请人 PARK JI HYUN;CHOI SEOG MOON;LEE YOUNG KI;SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 PARK JI HYUN;CHOI SEOG MOON;LEE YOUNG KI
分类号 H05K7/20;C23C28/00;C25D7/00;H05K1/00;H05K3/00 主分类号 H05K7/20
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