发明名称 |
Heat-Radiating Substrate and Method Of Manufacturing The Same |
摘要 |
Disclosed herein are a heat-radiating substrate and a method of manufacturing the same. The heat-radiating substrate includes: a base substrate with a heat sink, having a groove; an insulating layer formed on the base substrate by performing anodization thereon; and a circuit layer formed on the insulating layer, whereby the heat-radiating substrate with the heat-sink, made of metal material, is manufactured, thereby making it possible to protect devices weak against heat and thus solve the problem in view of reduced life span and degraded reliability. |
申请公布号 |
US2012127666(A1) |
申请公布日期 |
2012.05.24 |
申请号 |
US201113007545 |
申请日期 |
2011.01.14 |
申请人 |
PARK JI HYUN;CHOI SEOG MOON;LEE YOUNG KI;SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
PARK JI HYUN;CHOI SEOG MOON;LEE YOUNG KI |
分类号 |
H05K7/20;C23C28/00;C25D7/00;H05K1/00;H05K3/00 |
主分类号 |
H05K7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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