| 摘要 |
<p>This semiconductor package is provided with a semiconductor integrated circuit chip, which has an input matching circuit that has a high frequency signal input and is disposed in a die-bond region, and lead terminals disposed at the periphery of the die-bond region. The semiconductor package also has each of the terminals of the semiconductor integrated circuit and each of the lead terminals connected by bond wires. The semiconductor integrated circuit chip is disposed in a position shifted from the center of the die-bond region to a high frequency input terminal side that has the lead terminals for inputting the high frequency signal to the input matching circuit and/or a ground terminal side that has the lead terminals used for ground connections for the input matching circuit.</p> |
