发明名称 Optical detection module for Wafer inspection
摘要 PURPOSE: An optical detection module for a wafer test is provided to improve detection accuracy by mapping a wafer image through a plurality of image sensors which is effectively arranged. CONSTITUTION: A beam splitter(100) irradiates illumination to a test object wafer and divides a wafer image which is reflected. A prism unit(110) determines a progressive direction by penetrating and reflecting each wafer image which is divided by the beam splitter. A first detector gets the wafer image which is penetrated and reflected. The first detector is composed of a plurality of image sensors which respectively obtains an image area. A second detector is composed of a plurality of image sensors which obtains the rest area except for the image area obtained through the first detector.
申请公布号 KR101146922(B1) 申请公布日期 2012.05.23
申请号 KR20100079937 申请日期 2010.08.18
申请人 发明人
分类号 H01L21/66 主分类号 H01L21/66
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