发明名称 LAMINATED ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREFOR
摘要 <p>A method for manufacturing a laminated electronic component in which, when first plating layers that respectively connect a plurality of internal electrodes to each other and second plating layers that improves the mountability of a laminated electronic component are formed as external terminal electrodes, the entire component main body is treated with a water repellent agent after the formation of the first plating layers, and the water repellent agent on the first plating layers is then removed before the formation of the second plating layers. The gaps between the end edges of the first plating films on the outer surface of the component main body and the outer surface of the component main body are filled with the water repellent agent.</p>
申请公布号 KR101141327(B1) 申请公布日期 2012.05.23
申请号 KR20110008325 申请日期 2011.01.27
申请人 发明人
分类号 H01G4/12;H01G2/12;H01G4/224;H01G4/232;H01G4/30 主分类号 H01G4/12
代理机构 代理人
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