发明名称 |
Cluster tool architecture for processing a substrate |
摘要 |
An apparatus for processing substrates using a multi-chamber processing system (e.g., a cluster tool) that has an increased system throughput, increased system reliability, a smaller system footprint, and a more repeatable wafer history. Embodiments provide for a cluster tool comprising first and second processing racks, each having two or more vertically stacked substrate processing chambers, a first robot assembly able to access the first processing rack from a first side, a second robot assembly able to access the first processing rack from a second side and the second processing rack from a first side, a third robot assembly able to access the second processing rack from a second side, and a fourth robot assembly able to access the first and second processing racks and to load substrates in a cassette.
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申请公布号 |
US8181596(B2) |
申请公布日期 |
2012.05.22 |
申请号 |
US20080254750 |
申请日期 |
2008.10.20 |
申请人 |
ISHIKAWA TETSUYA;ROBERTS RICK J.;ARMER HELEN R.;VOLFOVSKI LEON;PINSON JAY D.;RICE MICHAEL;QUACH DAVID H.;SALEK MOHSEN S.;LOWRANCE ROBERT;BACKER JOHN A.;WEAVER WILLIAM TYLER;CARLSON CHARLES;WANG CHONGYANG;HUDGENS JEFFREY;HERCHEN HARALD;LU BRIAN;APPLIED MATERIALS, INC. |
发明人 |
ISHIKAWA TETSUYA;ROBERTS RICK J.;ARMER HELEN R.;VOLFOVSKI LEON;PINSON JAY D.;RICE MICHAEL;QUACH DAVID H.;SALEK MOHSEN S.;LOWRANCE ROBERT;BACKER JOHN A.;WEAVER WILLIAM TYLER;CARLSON CHARLES;WANG CHONGYANG;HUDGENS JEFFREY;HERCHEN HARALD;LU BRIAN |
分类号 |
B05C13/02;C23C14/00;H01L21/677 |
主分类号 |
B05C13/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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