| 摘要 |
PURPOSE: A semiconductor package and a semiconductor system including the same are provided to arrange a wiring structure using an anodizing process, thereby easily forming a fine pitch. CONSTITUTION: A wiring structure(40) comprises an anodizing insulating region(14) and a wire(12). The anodizing insulating region is arranged in order to electrically separate the wire from a peripheral region. The wiring structure is arranged between a semiconductor device(110) and a package substrate(140). A chip pad is arranged on one side of the semiconductor device. A protection layer is formed in order to expose a part of the chip pad. |
