| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a semiconductor package substrate that can simultaneously form bumps of different forms by performing squeegee processes in a doubled manner. SOLUTION: The method of manufacturing a semiconductor package substrate according to the present invention comprises placing a circuit board 105 under a screen-printing mask 104; disposing on the mask 104 a pair of squeegees comprising a first squeegee 101 and a second squeegee 102 having hardness different from each other; performing first printing of the bump on the circuit board 105 by sliding the first squeegee 101 from one side of the mask 104 to the other side thereof; and performing second printing of the bump on the circuit board 105 by sliding the second squeegee 102 from one side of the mask 104 to the other side thereof. COPYRIGHT: (C)2012,JPO&INPIT
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