SOLUTION AND PROCESS FOR THE PRE-TREATMENT OF COPPER SURFACES USING AN N-ALKOXYLATED ADHESION-PROMOTING COMPOUND

摘要

The invention concerns a pretreatment solution for pretreating copper surfaces, and a method for the pre-treatment of a copper surface to allow a tight bond to be formed with plastic substrates. The solution comprises: a) hydrogen peroxide, b) at least one acid, and c) at least one nitrogen-containing, five-membered, heterocyclic compound, and d) additionally at least one nitrogen containing, adhesion-promoting compound selected from the group comprising, or consisting of, lactams, non-quaternary fatty amines, amides and polyamides, which is connected at one or more of its nitrogen atoms with at least one residue of formula (I) wherein n is an integer from 1 to about 100, R1 is hydrogen or a hydrocarbon residue with 1 to about 6 carbon atoms, R2 is hydrogen or a hydrocarbon residue with 1 to about 6 carbon atoms, and each R1 and R2 in a -(CHR1CHR2-O)- moiety can be selected independently of each R1 and R2 in another -(CHR1CHR2-O)- moiety, with the proviso that the nitrogen- containing, five-membered, heterocyclic compound selected for component c) is not connected at any of its nitrogen atoms with a residue of formula (I).