| 摘要 |
Disclosed herein are a lead pin for a package substrate and a package substrate using the same. The lead pin for a package substrate, includes: a connection pin having a first through hole; and a pin head part provided with a groove including a second through hole formed therein and having a first head formed at one end part of the connection pin in a trapezoidal column shape, wherein the first through hole and the groove are connected to each other through the second through hole through which the upper portion and the lower portion the lead pin penetrate each other, whereby voids generated at the time of reflow can be discharged to the outside through the through hole formed in the lead pin, thereby making it possible to reduce a defect rate generated during a process of manufacturing a package substrate. |
