发明名称 |
UNIVERSAL RADIO FREQUENCY SHIELD REMOVAL |
摘要 |
Apparatus and methods for removing components soldered to a printed circuit board (PCB). Embodiments presented generally include a contact plate having a component specific platform offset from the contact plate body. The offset platform may be substantially identical in size and shape as the component to be removed. Accordingly, contact between a heated platform and component may allow for conductive heating to occur based on contact with the component. Thus, forced air or convective heating of the component does not occur such that solder joint defects in adjacent components may be prevented. A vacuum retention port may be provided at an interface of the platform and component when in contact. The vacuum retention port may allow the freed component to be removed from the PCB using vacuum to hold the freed component to the platform. Also, apparatus for automation of a process according to the forgoing are presented. |
申请公布号 |
US2012118940(A1) |
申请公布日期 |
2012.05.17 |
申请号 |
US201213356385 |
申请日期 |
2012.01.23 |
申请人 |
CHEUNG DASON;SOTELO SIMON MEDINA;AVELAR ENRIQUE;LOPEZ OMAR GARCIA;FLEXTRONICS AP, LLC |
发明人 |
CHEUNG DASON;SOTELO SIMON MEDINA;AVELAR ENRIQUE;LOPEZ OMAR GARCIA |
分类号 |
B23K1/018 |
主分类号 |
B23K1/018 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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