发明名称 ELECTRONIC COMPONENT INSPECTING WIRING BOARD AND MANUFACTURING METHOD THEREOF
摘要 <P>PROBLEM TO BE SOLVED: To provide an electronic component inspecting wiring board including a resin insulating part in which each wiring layer formed between a plurality of resin insulating layers is accurately arranged on a predetermined position, and to provide a manufacturing method capable of surely manufacturing the wiring board. <P>SOLUTION: The electronic component inspecting wiring board 1a includes a resin insulating part RZ including a plurality of resin insulating layers z1 to z4 laminated along the thickness direction and wiring layers 6 to 8 respectively arranged between the resin insulating layers z1 to z4. Each of the resin insulating layers z1 to z4 is configured by a first resin layer 4 composed of thermosetting resin and a pair of second resin layers 5 arranged on both the faces of the first resin layer 4 and composed of thermoplastic resin. In the thickness direction of the resin insulating layers z1 to z4, de-energized via conductors dv1, dv2 are formed so as to pierce at least one of the second resin layers 5 and continuously pierce a part or all of the first resin layer 4, and both ends of the de-energized via conductors dv1, dv2 are not brought into contact with the wiring layers 6 to 8. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012093103(A) 申请公布日期 2012.05.17
申请号 JP20100238292 申请日期 2010.10.25
申请人 NGK SPARK PLUG CO LTD 发明人 TOJO TAKATOSHI;HIRANO SATOSHI;NAGAYA YOSHIAKI;FUKUI RYOTA;IWATA MUNEYUKI;SUZUMURA SHINJI
分类号 G01R1/073;H05K3/46 主分类号 G01R1/073
代理机构 代理人
主权项
地址