发明名称 |
Semiconductor Device And Method Of Manufacturing Semiconductor Device |
摘要 |
A semiconductor chip includes a magnetic storage device and includes an electrode pad on a first face. The semiconductor chip is coated with a magnetic shield layer in a state in which at least the electrode pad is exposed. The semiconductor chip is mounted on an interconnect substrate through a bump. At least one of the semiconductor chip and the interconnect substrate includes a convex portion, and the bump is disposed over the convex portion.
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申请公布号 |
US2012119338(A1) |
申请公布日期 |
2012.05.17 |
申请号 |
US201113200944 |
申请日期 |
2011.10.05 |
申请人 |
WATANABE TAKAHITO;YAMAMICHI SHINTARO;USHIYAMA YOSHITAKA;RENESAS ELECTRONICS CORPORATION |
发明人 |
WATANABE TAKAHITO;YAMAMICHI SHINTARO;USHIYAMA YOSHITAKA |
分类号 |
H01L23/552;H01L21/02 |
主分类号 |
H01L23/552 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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