发明名称 ELECTROLESS GOLD PLATING LIQUID AND ELECTROLESS GOLD PLATING METHOD
摘要 <P>PROBLEM TO BE SOLVED: To provide electroless gold plating liquid capable of gilding directly on a plated film of a base metal such as nickel or palladium, forming a gold-plated film with a thickness of &ge;0.1 &mu;m, forming a uniform gold-plated film, and performing a plating work stably. <P>SOLUTION: This electroless gold plating liquid contains a water-soluble gold compound and either of hexahydro-2,4,6-trimethyl-1,3,5-triazine or hexamethylenetetramine. Preferably, hexahydro-2,4,6-trimethyl-1,3,5-triazine or hexamethylenetetramine is contained as much as 0.1-100 g/L. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012025974(A) 申请公布日期 2012.02.09
申请号 JP20100162603 申请日期 2010.07.20
申请人 ELECTROPLATING ENG OF JAPAN CO 发明人 ASAKAWA TAKANOBU;FUJINAMI TOMOYUKI
分类号 C23C18/42 主分类号 C23C18/42
代理机构 代理人
主权项
地址