发明名称 |
PRECISE REAL TIME AND POSITION LOW PRESSURE CONTROL OF CHEMICAL MECHANICAL POLISH (CMP) HEAD |
摘要 |
A method and system for detecting and controller wafer surface pressure distribution. Detecting and controlling wafer surface pressure distribution comprises measuring in situ wafer uniformity of a wafer at a plurality of locations of the wafer; and in response to the measured wafer uniformity controlling through a feedback loop in situ CMP head pressure applied at the plurality of locations of the wafer in real time to polish the wafer. |
申请公布号 |
US2012122373(A1) |
申请公布日期 |
2012.05.17 |
申请号 |
US20100946155 |
申请日期 |
2010.11.15 |
申请人 |
ZHANG JOHN H.;FERREIRA PAUL;GOLDBERG CINDY;STMICROELECTRONICS, INC. |
发明人 |
ZHANG JOHN H.;FERREIRA PAUL;GOLDBERG CINDY |
分类号 |
B24B49/04;B24B49/08 |
主分类号 |
B24B49/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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