发明名称 MANUFACTURING METHOD OF HEAT RADIATION MEMBER AND SEMICONDUCTOR DEVICE USING HEAT RADIATION MEMBER
摘要 <P>PROBLEM TO BE SOLVED: To provide a heat radiation member in which an insulation sheet, which is processed to fit with a surface form of a heat sink without causing chips in the insulation sheet and swarf, is bonded to the heat sink. <P>SOLUTION: A manufacturing method of a heat radiation member in which an insulation sheet is bonded to a heat sink includes a process in which a heat sink 10 having a flat surface is prepared, a process in which an insulation sheet 20 is overlapped on the heat sink so as to cover at least an upper surface of the heat sink, and a cutting process in which an edge part of the insulation sheet is scraped so that the form of the insulation sheet matches the form of the upper surface of the heat sink. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012094883(A) 申请公布日期 2012.05.17
申请号 JP20110267550 申请日期 2011.12.07
申请人 MITSUBISHI ELECTRIC CORP 发明人 SANO KO;KOMORI HIDEKI;HAYASHI KENICHI
分类号 H01L23/40;H01L23/36 主分类号 H01L23/40
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