| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a support plate peeling apparatus which removes an adhesive adhered to a semiconductor wafer after peeling the support plate without damaging the semiconductor wafer under dry conditions. <P>SOLUTION: A demounter 10 includes a peel roller 204, a first pressurizing member 208, a second pressurizing member 212, a stepping motor 222, a ball screw 226, first elastic members (238, 240), and second elastic members (234, 236). The first elastic members (238, 240) are formed so that downward force acting from the stepping motor 222 and the ball screw 226 to the second pressurizing member 212 is transmitted to the first pressurizing member 208. The second elastic members (234, 236) are disposed so that a cap bolt 244 gets compressed when suspending the first pressurizing member 208. <P>COPYRIGHT: (C)2012,JPO&INPIT |
