| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of mounting an electronic component with a bump that can secure mounting quality of high precision when the electronic component with the bump which needs to secure a height and levelness of a mounted surface with high precision is mounted. <P>SOLUTION: In a stack mounting method of stacking and mounting a semiconductor chip on a semiconductor wafer, heights at a plurality of height measurement points on the mounting surface where the semiconductor wafer is sucked and held, are measured to store height data as characteristic data of a wafer holding stage in storage means, in a component mounting step of repeating an individual component mounting operation for mounting an upper-stage semiconductor chip at one component mounting position of the semiconductor wafer placed on the wafer holding stage, the parallelism of a mounting surface at the component mounting position and the semiconductor chip held on a mounting head are adjusted in every individual component mounting operation by driving stage height adjustment means as stage inclination adjustment means based upon stored height data. <P>COPYRIGHT: (C)2012,JPO&INPIT |
