发明名称 |
APPARATUS AND METHOD FOR MANUFACTURING LED PACKAGE |
摘要 |
An apparatus for manufacturing an light emitting diode (LED) package, includes: a heating unit heating an LED package array in a lead frame state in which a plurality of LED packages are installed to be set in an array on a lead frame; a testing unit testing an operational state of each of the LED packages in the LED package array by applying a voltage or a current to the LED package array heated by the heating unit; and a cutting unit cutting only an LED package determined to be a functional product or an LED package determined to be a defective product from the lead frame to remove the same according to the testing results of the testing unit.
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申请公布号 |
US2012122250(A1) |
申请公布日期 |
2012.05.17 |
申请号 |
US201113278887 |
申请日期 |
2011.10.21 |
申请人 |
JI WON SOO;KIM CHOO HO;OH SUNG HOON;KIM MIN HWAN;SHIN BEOM SEOK;SAMSUNG LED CO., LTD. |
发明人 |
JI WON SOO;KIM CHOO HO;OH SUNG HOON;KIM MIN HWAN;SHIN BEOM SEOK |
分类号 |
H01L21/66;B21B15/00 |
主分类号 |
H01L21/66 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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